The 17th Intel NEX Summit 2024 with the theme "Everywhere with Chip and AI" was held in Tianjin on July 23rd-24th, 2024. The conference invited over 400 partners in the Internet of Things, networking, and edge computing fields, with 60 plus on-site demos. As a partner of Intel CTE, Techvision was invited to attend.
During the conference, Techvision's staff had in-depth exchanges with Intel executives and other attending guests, actively introducing Techvision's products and services, which were highly recognized. Intel expressed that Techvision's R&D and manufacturing capabilities were commendable and indicated plans to strengthen cooperation with Techvision to jointly develop and launch superior products.
At this summit, Techvision showcased the latest full range of solutions for Intel NAS, attracting considerable attention from industry professionals. Techvision currently develops various Intel platform motherboards suitable for NAS products, covering Gemini Lake, Tiger Lake, and Jasper Lake. Ranging from supporting up to 4 drive bays to a maximum of 12 drive bays, these motherboards cater to various storage applications and possess features of efficiency, security, and reliability.
The wave of AI is sweeping the world with an unstoppable force, and the integration of intelligent edge and AI is creating unprecedented opportunities for enterprises. Techvision proactively aligns with the trend of AI development, increasing research and development and introducing new consumer smart terminal products that integrate new generation AI technology, cloud computing technology, and edge computing technology, such as cloud computers, cloud tablets, home storage, home computing devices, AI NAS, etc. At the same time, the company is actively advancing the research and development of AI PC products.
The Intel conference allowed participating companies to see the vigorous development and enormous potential of edge computing and AI. In the future, Techvision will continue to maintain close cooperation with Intel, explore innovative collaboration opportunities, enhance its competitiveness in the smart terminal product field, and provide forward-looking and sustainable solutions to customers globally, achieving extensive cooperation and mutual win-win results.